● Materials of metal substrate
● Material of copper layer
● Thermal conductivity of the glue
● Design of the pad
● Hardness and toughness of the substrate
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In physics, thermal conductivity (often denoted k, λ, or κ) is the property of a material to conduct heat. The thermal conductivity of a material may depend on temperature, the composition of the material, the apparent density, internal structure, porosity rate, moisture content, etc. The materials with low apparent density, loose internal structure, high porosity rate and low moisture content are used to decrease the thermal conductivity and ensure the good heat insulation effect.
PCB Aluminum is MCPCB (Metal Core PCB). The following factors influence the thermal conductivity of PCB Aluminum:
1. The materials of metal substrate, such as the aluminum substrate, as well as copper substrate and ceramic substrate. They are also divided into many kinds, and each of the thermal conductivity varies from alloy to alloy.
2. The material of copper layer in the circuit: Even if the copper is exactly the same, but differs from the different processes.
3. The thermal conductivity of the glue. The better the insulation of the glue is, the worse the thermal conductivity is.
4. The design of the pad in the circuit: Different pad design results in thermal effects.
5. The hardness and toughness of the substrate determines the overall flatness, and determines the thermal conductivity of the aluminum substrate.