Premium PCB Capability

Category	Capability	Mass batch	Small Batch	Sample Order
Base Material	Normal Tg Value FR-4	Shengyi S1141
	High Tg Value, Halogen Free	Shengyi S1165 (Orange-red core board)
	High CTI	Shengyi S1600（CTI≥600V）
	High Tg Value FR-4	S1000-2, S1000-2M, IT180A
	Ceramic Powder Filled High Frequency Board	Rogers4003, Rogers4350, Arlon25N
	PTFE High Frequency Material:	Rogers, Taconic, Arlon, WANGLING
	PTFE Prepreg	Taconic, TPG, Fastrise
	High Speed (1-5 G)	Tu-862, S7038, S1165, Isola-FR408HR, Isola-FR406, EMC-EM370, IT170GRA
	High Speed (5-10 G)	Tu-872, s7439, N4000-13SI, M4, Tu-863
	High Speed (10-25 G)	M6, Tu-883
	High Speed (>25 G)	M7, Tu-993
Layers	1-30	1-30	1-30	1-30
Laser order	1-4	1-3	1-3	1-4
Delivery Size (mm)	Max Size (mm)	460*560	460*560	550*900
Delivery Size (mm)	Min Size (mm)	10*10	10*10	10*10
Width / Gap	Inner（mil）	0.5OZ base copper:3/3	1.0OZ base copper:4/4	2.0OZ base copper:5/6
		3.0OZ base copper:7/9	4.0OZ base copper: 8/12	5.0OZ base copper: 10/15
		6.0OZ base copper: 12/18	10 OZ base copper: 18/24	12 OZ base copper: 20/28
	Outer（mil）	1/3OZ base copper:3/3	0.5OZ base copper:4/4	1.0OZ base copper:5/5
		2.0OZ base copper:6/8	3.0OZ base copper: 7/10	4.0OZ base copper: 8/13
		5.0OZ base copper: 10/16	6.0OZ base copper: 12/18	10 OZ base copper: 18/24
		12 OZ base copper: 20/28	15 OZ base copper: 24/32
Line Width Tolerance	＞10.0 mil	±20%	±1.5mil	±1.0mil
Line Width Tolerance	≤10.0 mil	±20%	±1.0mil	±1.0mil
Copper Thickness	Inner layer（OZ）	6	6	6
	Out layer（OZ）	8	8	8
	Inner double layer	18/35um、35/70um	18/35um、35/70um	18/35um、35/70um、70/105um
Board thickness for resin plug hole	0.3-4.0mm	0.3-4.0mm	0.3-4.0mm	0.3-4.0mm
Board thickness（mm）	0.1-8	0.3-5.0	0.3-5.0	0.1-8.0
Board Thickness tolerance	＞1.0 mm	±10%	±8%	±8%
Board Thickness tolerance	≤1.0 mm	±0.1mm	±0.1mm	±0.1mm
Board thickness/drill bit		10:01:00	12:01:00	13:01:00
Contour	Bevel edge	20-60 degree, ±5degree	20-60 degree, ±5degree	20-60 degree, ±5degree
Bow and twist		≤0.75%	≤0.75%	≤0.5%

Category	Capability	Mass batch	Small Batch	Sample Order
Drilling	Min laser （mm）	3mil	3mil	3mil
	Max laser （mm）	8mil	8mil	8mil
	Min CNC（mm）	0.2	0.15	0.15
	Max CNC drill bit（mm）	6.5	6.5	6.5
	Min Half Hole(mm)	0.5	0.4	0.4
	PTH Hole Normall (mm)	±0.1	±0.075	±0.075
	PTH Hole Pressing Hole(mm)	±0.05	±0.05	±0.05
	Hole Angle (conical)	Width of upper diameter≤6.5mm：800、900、1000、1100； Width of upper diameter≥6.5mm：900；
	Precision of Depth-control Drilling（mm）	±0.10	±0.075	±0.05
	Number of blind CNC holes of one side	≤2	≤3	≤4
	Minimum via hole spacing (different network, military, medical, automobile )mm	0.5	0.45	0.4
	Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm	0.4	0.35	0.3
	The minimum hole wall spacing of the over hole (the same network mm)	0.2	0.2	0.15
	Minimum hole wall spacing (mm) for device holes	0.8	0.7	0.7
	The minimum distance from via hole to the inner copper or line	0.2	0.18	≤10L: 0.15
				>10L: 0.18
	The min distance from Device hole to inner copper or line	0.3	0.27	0.25
	Diameter range of resin plug hole (mm)	0.1-0.45	0.1-0.45	0.1-0.7
	Min diameter of back drilling (mm)	0.5	0.5	0.2
	Back drill depth accuracy tolerance (mm)	±0.05	±0.03
	Max Ratio of hole diameter to board thickness	10:1	10:1	20:1
	Tapered hole, stepped hole angle and diameter	Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm)	Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm)	Special drills: 82°, 90°, 100°, 135° (diameter range of tapered hole drills is 0.3-10mm)
	Tapered hole, stepped hole angle and diameter	Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175--6.3mm)	Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175--6.3mm)	Normal drills: Angle 130° (drill φ≤3.175mm), 165° (drill φ 3.175--6.3mm)
Welding Ring(mil)	Via hole	4（HDI 3mil）	3.5（HDI 3mil）	3
	Component hole	8	6	6
Final Board Thickness	＞1.0 mm	±10%	±8%	±8%
Final Board Thickness	≤1.0 mm	±0.1mm	±0.1mm	±0.1mm
CNC	contour tolerance（mm）	±0.15	±0.10	±0.10
	V-CUT Tolerance of residual thickness(mm)	±0.15	±0.10	±0.10
	（mm）
	Routing slot（mm）	±0.15	±0.10	±0.10
	Precision of controlled deep milling（mm）	±0.15	±0.10	±0.10

Category	Capability	Mass batch	Small Batch	Sample Order
Solder Dam (mil)	（solder mask）	5	4	4
Solder Dam (mil)	（hybrid）	6	5	5
Solder Mask Color	Green, Yellow, Black, Blue, Red, White, Matte Green, Matte Black, Orange
Silkscreen Color	White, Yellow, Black, Orange

Category	Capability	Mass batch	Small Batch	Sample Order
Immersion gold	Ni thickness (micro inch)	118-236	118-236	118-236
Immersion gold	Max gold (uinch)	3	3	6
Hard gold(Au thick)	Gold finger	Angle: 20°, 30°, 45°, 60°	Angle: 20°, 30°, 45°, 60°	Angle: 20°, 30°, 45°, 60°
NiPdAu	NI (uinch)	118-236
	PA (uinch)	2-5
	Au (uinch)	1-5
Graph electric gold	NI (uinch)	120-400
Graph electric gold	AU (uinch)	1-3
Immersion tin	Tin (um)	0.8-1.2
Immersion Ag	Ag (uinch)	6-10
OSP	thick (um)	0.2-0.5
HAL/HAL LF	BGApad(mm)	≥0.3×0.3
	thickness （mm）	0.6≤H≤3.0
	Board thickness vs hole diameter	Press hole≤3:1
	Tin（um）	2.0-40.0
Other	Soft gold, Immersion gold+OSP, HAS+Gold finger, Immersion gold+gold finger, Water gold+Selective hard gold, OSP+Gold finger

Category	Capability	Mass batch	Small Batch	Sample Order
Special Technique		Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination	Buried magnetic core PCB	Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB